Received: April 15, 2003
From: Robert Barr, <rbarr@cisco.com>

Subject: RFC 2026 statement re draft-hakala-diameter-credit-control-XX.txt

Cisco has a pending patent application related to the subject matter of
"Diameter Credit Control Application"
<draft-hakala-diameter-credit-control-XX.txt>. 

If technology in this document is included in a standard adopted by the 
IETF and any claims of any Cisco patents are necessary for practicing 
this standard, any party will be able to obtain a license from Cisco to use 
any such patent claims under reasonable, non-discriminatory terms to 
implement and fully comply with the standard.

For information contact: 

Robert Barr 
Worldwide Patent Counsel 
Cisco Systems 
408-525-9706 
rbarr@cisco.com